New Thermally Conductive Adhesives from Intertronics
22/08/2016 Intertronics
The latest applications in energy and electrical engineering require ever higher levels of thermal conductivity, hence a new generation of thermally conductive two-part epoxy adhesives from Intertronics.These new high performance adhesives offer excellent thermal conductivity, so enhancing the effectiveness of heat paths found in applications such as LED heat sink attachment, chip assembly, encapsulation, potting of thermal sensors, assembly of power module, connection of pipes in heat exchangers and the bonding and potting of battery cells and electric motors. They can help optimise production processes with a choice of accelerated thermal cures in about 15 minutes or 24 hours at room temperature.
A good example is Polytec TC 433, an advanced semi-rigid boron nitride filled adhesive. It features 2 W/mK thermal conductivity and a glass transition around 110°C after thermal curing, withstanding up to 220°C continuous operation temperature
For more information, please contact:
Peter Swanson
Intertronics
Unit 17
Station Field Industrial Estate
Banbury Road
Kidlington
Oxfordshire
OX5 1JD
Tel: +44 1865 842842
Fax: +44 1865 842172
Email: info@intertronics.co.uk
Web: www.intertronics.co.uk
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